Equipping with the leading technology and facilities which allow us to produce the high-quality wafers with a variety of different sizes from G12, M10 to M6, moreover the N type wafers which ideally match the TOPCon, HJT etc. the next cell technologies.
R&D ability also for N type wafers which ideally match the TopCon, HJT etc. the next cell technology.
P&N type
P type
N type
P type
G12 (210mm)
CZ
0.4-1.1 ohm.cm
155 +20/-10 μm
M10 (182mm) CZ 0.4-1.1 ohm.cm 155 +20/-10 μm
N type
G12 (210mm）
CZ 0.3-2.1 ohm.cm
155 +20/-10 μm
M10 (182mm)
CZ
0.3-2.1 ohm.cm 155 +20/-10 μm
Core advantage
Customer satisfaction can only be achieved by quality and time to time services.
Low oxygen
15ppm which is lower than the industry
standard
Thinner wafer
Thinner slicing technology to reduce the silicon
cost
Big size ingot
Bigger ingot dimension to lower the silicon
cost of wafer
High lifetime
Higher than 70u which is better than the
industry standard
Contact Us
If you have any questions, please contact us and we will reply to you as soon as possible. Thanks!
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